• Find Your IPM Package: Complete Range of Models

    HXSEMI IPM products are widely used in industrial inverters, HVAC systems, servo drives, and variable frequency drives (VFD), helping engineers reduce development time and achieve stable performance in demanding industrial environments.

  • Full Range of Packages

    HXSEMI provide the industry’s widest selection of IPM packages, ranging from compact DIPs to high-power modules. This enables flexible design adaptation for diverse applications—from consumer electronics to demanding industrial systems.

    Full In-House Control

    HXSEMI operates proprietary packaging and testing facilities, maintaining full oversight of key processes. Core chips are produced by Huahong Group, the world’s sixth-largest foundry, ensuring consistent wafer-level quality and process reliability.

    Military-Grade Reliability

    Our end-to-end quality system covers design, manufacturing, and testing. Every HXSEMI IPM delivers stable performance under extreme temperature, humidity, and vibration, with MTBF (mean time between failures) significantly above industry norms.

  • HXSEMI's Selection of IPM Packaging

    Please select the product you want, or simply contact us.

  • 6 Key Advantages of HXSEMI IPM

    PFC and 3 Phase Inverter

    HXSEMI’s IPM integrates the power factor correction (PFC) stage and the three-phase full-bridge inverter into a single module, while conventional IPMs typically include inverter functionality only.

    This integrated architecture simplifies system design, reduces PCB area and BOM cost, and improves overall energy efficiency, enabling easier compliance with stringent global energy efficiency standards.

  • 7-Channel Driver & Bootstrap

    HXSEMI’s IPM features a self-developed 7-channel high-voltage gate driver IC with an integrated bootstrap diode circuit. This design eliminates the need for external bootstrap diodes and capacitors.

    By removing these external components, the solution simplifies the application circuit, reduces component count, and enhances system integration and reliability.

  • Accurate Junction Temperature Sensing

    HXSEMI IPMs replace conventional DBC ceramic substrates with a fully adopted IMS (Insulated Metal Substrate) architecture.

    The IMS substrate offers high thermal conductivity combined with robust electrical insulation, significantly improving heat dissipation and enabling operation at higher power density. In addition, its superior mechanical toughness provides excellent resistance to thermal shock and vibration, substantially extending module lifetime in demanding applications.

  • Ultra-Fast FLT Protection

    HXSEMI’s IPM features an ultra-fast fault (FLT) feedback mechanism for overcurrent and short-circuit conditions.

    • Fault response delay: ~700 ns
      The module detects and shuts down the power devices within sub-microsecond time, providing rapid protection under fault conditions.
    • Fault recovery time: ~1700 ns
      After fault clearance, the module quickly returns to a ready state, enabling fast system recovery and minimizing downtime caused by transient faults.

  • IMS Substrate Technology

    HXSEMI IPMs replace conventional DBC ceramic substrates with a fully adopted IMS (Insulated Metal Substrate) architecture.

    The IMS substrate offers high thermal conductivity combined with robust electrical insulation, significantly improving heat dissipation and enabling operation at higher power density. In addition, its superior mechanical toughness provides excellent resistance to thermal shock and vibration, substantially extending module lifetime in demanding applications.

  • Junction Temperature Sensing

    HXSEMI IPMs integrate a negative temperature coefficient (NTC) thermistor directly onto the IMS substrate, positioned in close proximity to the power chip thermal hotspot.

    This layout enables fast and direct junction temperature sensing, delivering significantly higher accuracy than designs with NTCs mounted on the module case or away from the heat source. The result is reliable and precise thermal data for effective system-level overtemperature protection.

  • Start Choosing Your IPM Now!

    Get in Touch with HXSEMI!

    For customized requirements, please send an email.

Cookie的使用
我们使用cookies来确保流畅的浏览体验。若继续，我们认为你接受使用cookies。
了解更多