• IPM-SDIP-25 Package

    Intelligent Power Modules (IPM) are widely used in industrial motor drive and inverter systems due to their high integration, built-in protection and stable performance.

  • What are the advantages of HXSEMI's SDIP-25?

    The SDIP, is a narrow-pitch variant of the standard DIP package.By reducing pin spacing, it retains the core advantages of the DIP family—ease of handling, robustness, and thermal performance—while providing a more compact form factor.

    This makes SDIP an ideal choice for applications requiring a higher number of I/O pins under PCB space constraints. Its standardized rectangular geometry also facilitates the installation of clip-on heatsinks, ensuring efficient heat dissipation without compromising board layout efficiency.

    SYIM06S60

    • Package：SDIP-25FP
    • Voltage(V): 600
    • Current(A): 6
    • RDS(on)@Typ.Tj=25°C: 2.0

    SYIM10S60

    • Package：SDIP-25FP
    • Voltage(V): 600
    • Current(A): 10
    • RDS(on)@Typ.Tj=25°C: 2.0

  • Applications:

    Leveraging its balance of reliability, thermal performance, and pin count, the SDIP-25 package is often employed in industrial and high-end applications where extreme miniaturization is not the priority. HXSEMI IPM solutions are designed for industrial automation, HVAC inverters, servo drives and variable frequency drives, enabling compact system design and improved operational reliability.

    • Frequency converter
    • Air Conditioning compressor
    • Air cleaner
    • Dish washer
    • Cooker hood

  • Features:

    • Integrated 6 fast recovery power MOSFETs (500 V / 5 A)
    • Integrated high voltage gate drive circuit
    • Compatible with 3.3 V & 5 V input signal, effective at high level
    • Integrated temperature output
    • Built-in quick recovery bootstrap diode
    • Insulation class 1500 V rms / min
    • Integrated bootstrap functionality
    • High reliability and thermal stability, good parameter consistency
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