



- Products
- IPM Modules
- IGBT Modules
- IGBT Discretes
- IGBT Chips
- SiC
- FRD(MUR)
- Bridge Rectifier
- Application
- Energy Vehicle
- Home Appliance
- Renewable Energy
- Industrial Equipment
- Data Centers
- …
- Products
- IPM Modules
- IGBT Modules
- IGBT Discretes
- IGBT Chips
- SiC
- FRD(MUR)
- Bridge Rectifier
- Application
- Energy Vehicle
- Home Appliance
- Renewable Energy
- Industrial Equipment
- Data Centers



- Products
- IPM Modules
- IGBT Modules
- IGBT Discretes
- IGBT Chips
- SiC
- FRD(MUR)
- Bridge Rectifier
- Application
- Energy Vehicle
- Home Appliance
- Renewable Energy
- Industrial Equipment
- Data Centers
- …
- Products
- IPM Modules
- IGBT Modules
- IGBT Discretes
- IGBT Chips
- SiC
- FRD(MUR)
- Bridge Rectifier
- Application
- Energy Vehicle
- Home Appliance
- Renewable Energy
- Industrial Equipment
- Data Centers

Team Strength
The technology center is jointly established by academicians, and core members have extensive experience in industrialization.

Founder、Chairman、CEO
- Mozi LaboratoryPower
- Semiconductor R&D Center

CAS Academician: Jack Project Collaboration
- President, Henan Academy of Sciences | Director, Mozi Laboratory
- Co-founder, Mozi Laboratory Power Semiconductor Technology Center

Product & Applications
Quality & Process
Finance & Operations
Qing Hua, PhD – CDO, Research Fellow
- Former chip design manager at a Fortune 500 company
- Principal investigator of National Natural Science Foundation projects
Qiang Li, PhD – CMO, Senior Engineer
- Former application technology director at a Fortune 500 company
- Recipient of the National Science and Technology Progress Award
HX Jiang, PhD – CRO, Associate Research Fellow
- Overseas-trained under a leading authority in third-generation semiconductors
- Author of 60+ core journal papers
Xiajiang Zhou – CQO, Senior Engineer
- Former equipment manager at a Fortune 500 company
- Former quality director of a listed semiconductor company
Andy Chu, PhD – CPO, Senior Engineer
- Former process director at an international semiconductor company
- Holder of 50+ patents in high-voltage process technologies.
Jingxin Deng – Senior Councillor, Professor
- Doctoral supervisor at Tsinghua University
- Author of five books on automation control and process design
Xi Wu – CFO, Certified Public Accountant (CPA)
- Former finance manager at a listed company
- Former operations director of a successfully IPO-listed startup
Jiankang Wu – CSO, MBA
- Former sales manager at a Fortune 500 company
- Former customer director at a leading listed semiconductor company
GuSu – Senior Councillor, Professional Engineer
- Former chip design director at a Fortune 500 company
- Currently module design director at a Fortune 500 enterprise
Technical Team
The HXSEMI R&D team consists of 30 members, including 3 PhDs and 11 masters. There are also 2 external expert professors. They collaborate with top domestic universities and research institutes to jointly cultivate power semiconductor talents and jointly develop the third-generation semiconductor product SiC.

CAS Academician: Jack
- President of Henan Academy of Sciences
- Director of the Mozi Laboratory
- Established the Mozi Laboratory Power Semiconductor Technology Center in collaboration with Huixin Semiconductor.

CTO: Dr. William
- Holds over 800 patents in power semiconductor integration; a four-time recipient of the China Patent Award.
- Led major national initiatives including the "02 Special Project" and "Made in China 2025".
- Developed China's first high-voltage integrated circuit (HVIC) and intelligent power module (IPM)
- Have provided in-depth guidance to enterprises such as BYD, Resources, and Sino.

R&D: Ray
Graduated from Tsinghua University, Ray leads our R&D efforts with deep expertise in wide-bandgap semiconductors (SiC/IPM) and IGBT module design.
His team pioneers next-generation power devices, optimizing thermal performance, switching efficiency, and ruggedness for electric vehicles, solar inverters, and industrial motor drives.
Our Development History
12021
- Shenzhen Huixin Semiconductor Co., Ltd. (HXSEMI) was established.
- First-year revenue exceeded 20 million yuan
22022
- Group revenue increased fourfold.
32023
- Over 400 patents filed
- Led multiple national semiconductor industry standards
- Overseas offices set up in Japan, South Korea, Europe, North America, etc.
42024
- National Specialized, Sophisticated, Unique and New "Little Giant" Enterprise
- First AI fully automatic power module packaging line in China
52025
- No.1 in China for IPM modules & IPM chips sales
- Second Prize of Guangdong Science and Technology Progress Award
- Top Award in National Unicorn Enterprise Competition
62026
- First Prize of Science and Technology Progress by Guangdong Electronic Information Industry Association
HXSEMI is striving to become a world-leading semiconductor supplier.













