• IPM-DIP-23 Package

    600V Intelligent Power Module for Home Applications

  • What are the advantages of HXSEMI's DIP23?

    This 600V IPM is an integrated industrial power semiconductor module designed for motor drive and inverter applications.

    By combining IGBT devices, gate drivers and protection circuits in one package, the module improves system reliability, reduces PCB complexity and shortens product development cycles for industrial power electronics designs.

    SYIM03M60ATA

    • Package：DIP-23H
    • Voltage(V): 600
    • Current(A): 3
    • RDS(on)@Typ.Tj=25°C: 2.5

    SYIM05M50BTA

    • Package：DIP-23H
    • Voltage(V): 600
    • Current(A): 5
    • RDS(on)@Typ.Tj=25°C: 1.3

    SYIM06G60BTA

    • Package：DIP-23H
    • Voltage(V): 600
    • Current(A): 6
    • RDS(on)@Typ.Tj=25°C:

  • Applications:

    DIP-23 package represents a function-specific and cost-optimized packaging solution rather than a universal one.
    When a chip adopts the DIP-23 package, it signifies that the designer has achieved an optimal balance between functionality and cost, creating a precisely customized solution for that device's intended performance.

    • Frequency converter
    • Air Conditioning compressor
    • Air cleaner
    • Dish washer
    • Cooker hood
    • Refrigerator compressor

  • Features:

    • Integrated 6 fast recovery power MOSFETs
    • Integrated high voltage gate drive circuit
    • Compatible with 3.3 V & 5 V input signal, effective at high level
    • Integrated temperature output
    • Built-inquick recovery boot strap diode
    • Insulation class 1500 Vrms / min
    • Integrated bootstrap functionality
    • High reliability and thermal stability, good parameter consistency
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