• IPM-SOP-23 Package

    HXSEMI IPM solutions are designed for industrial automation, HVAC inverters, servo drives and variable frequency drives, enabling compact system design and improved operational reliability.

  • What are the key features of HXSEMI's SOP-23?

    The SOP-23 (Small Outline Package) is a surface-mount package, with leads extending from the sides rather than passing through the PCB.This design yields a much smaller footprint than any DIP package, enabling significant PCB space savings and supporting miniaturization and lightweight design in modern electronics. It allows complex circuitry to be integrated into a smaller board area.

    SYIM03M60ATD

    • Package：SOP-23H
    • Voltage(V): 600
    • Current(A): 3
    • RDS(on)@Typ.Tj=25°C: 2.5

    SYIM05M50BTD

    • Package：SOP-23H
    • Voltage(V): 500
    • Current(A): 5
    • RDS(on)@Typ.Tj=25°C: 1.3

    SYIM06G60BTD

    • Package：SOP-23H
    • Voltage(V): 600
    • Current(A): 6
    • RDS(on)@Typ.Tj=25°C:

  • Applications:

    Despite its compact size, the SOP-23 package typically employs thermally conductive encapsulation materials, and its exposed thermal pad can be directly soldered to the PCB copper layer for efficient heat dissipation. HXSEMI IPM solutions are designed for industrial automation, HVAC inverters, servo drives and variable frequency drives, enabling compact system design and improved operational reliability

    • Frequency converter
    • Air Conditioning compressor
    • Air cleaner
    • Dish washer
    • Cooker hood

  • Features:

    • Integrated high voltage gate drive circuit
    • Compatible with 3.3 V & 5 V input signal, effective at high level
    • Integrated temperature output
    • Built-in quick recovery bootstrap diode
    • Insulation class 1500V rms / min
    • Integrated bootstrap functionality
    • High reliability and thermal stability, good parameter consistency
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