Product Details : SYIM06G60BTA, SYIM03M60ATA, SYIM05M50BTA

Due to its unique configuration, the DIP-23 package is typically used for function-specific ICs, such as:

• High-precision analog devices requiring multiple independent power or ground connections (e.g., precision op-amps and data converters).
• Custom or driver ICs with pin counts between DIP-22 and DIP-24, tailored for specific functional requirements.
• Legacy power semiconductors or linear regulators emphasizing thermal performance and reliability.

In addition, HXSEMI's DIP-23 package is also applied in air conditioner fan motors, dishwashers, high-speed dryers, and small-capacity motors, combining proven mechanical robustness with cost-effective design.

Features:

• Integrated 6 fast recovery power MOSFETs
• Integrated high voltage gate drive circuit
• Compatible with 3.3 V & 5 V input signal, effective at high level
• Integrated temperature output
• Built-inquick recovery boot strap diode
• Insulation class 1500 Vrms / min
• Integrated bootstrap functionality
• High reliability and thermal stability, good parameter consistency

Internal Electrical Schematic: