• IPM-SDIP-26 Package

    This 650V Intelligent Power Module (IPM) is an integrated industrial power semiconductor module designed for motor drive and inverter applications.

  • What are the applications of HXSEMI's SDIP-26?

    The SDIP-26 package achieves an exceptional balance among pin count, mechanical strength, thermal performance, and compactness.Its sturdy through-hole leads are soldered directly through the PCB, forming an extremely reliable mechanical and electrical connection.
    This Intelligent Power Modules (IPM) construction enables the SDIP-26 to withstand severe vibration, impact, and thermal cycling, which is why it continues to be widely adopted in industrial, automotive, and aerospace applications. Its reliability far exceeds that of most surface-mount packages.

    SYIM15S60

    • Package：SDIP-26
    • Voltage(V): 650
    • Current(A): 15
    • RDS(on)@Typ.Tj=25°C: 1.7

  • Applications:

    By combining IGBT devices, gate drivers and protection circuits in one package, the module improves system reliability, reduces PCB complexity and shortens product development cycles for industrial power electronics designs.

    • Air conditioner compressors
    • Refrigerator compressors
    • Washing machine compressors
    • Small household appliances
    • Low-power frequency inverters

  • Features:

    • Built-in High Voltage Drive Circuit (HVIC).
    • The HVIC chip integrates a bootstrap diode with a current-limiting resistor
    • The high-side control voltage features undervoltage protection
    • The low-side LVIC features short-circuit current protection (SC), temperature output (TO), over-temperature protection (OTP), and undervoltage protection (UV)
    • Fault outputs (UV, SC, OTP) shut down the LVIC output when protection is triggered
    • Input interface compatible with 3.3 V & 5 V signals, active high
    • Insulation class: 2000 V rms / min
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