Product Details: SYIM10G60BTE

The DIP-25 refers to a dual in-line package with 25 pins. Its value lies not in miniaturization, but in its outstanding robustness, reliability, and ease of use.
The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints.
This makes the DIP-25 package indispensable in industrial, automotive, and aerospace systems operating under harsh environmental conditions.

Features:

• Integrated 6 fast recovery power MOSFETs
• Integrated high voltage gate drive circuit
• Compatible with 3.3 V & 5 V input signal, effective at high level
• Integrated temperature output
• Built-inquick recovery boot strap diode
• Insulation class 1500 Vrms / min
• Integrated bootstrap functionality
• High reliability and thermal stability, good parameter consistency

Internal Electrical Schematic: