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DIP-24: Built-in UVLO, OTP, OCP, and temperature sensing

DIP-24: Built-in UVLO, OTP, OCP, and temperature sensing

Chips: IGBT
Topological Function: Three-phase full-bridge
Typical Application: Air conditioning fan, dishwasher, high-speed blower, low-power motor
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Product Details: SYIM15G60BTB, SYIM20G60BTB, SYIM30G60BTB

As one of HXSEMI's classic and mature package platforms, DIP-24 benefits from decades of proven manufacturing and soldering process reliability, ensuring high production yield and minimal operational risk.

Features:

  • Integrated 6 low-loss IGBTs
  • Integrated high voltage gate drive circuit (HVIC)
  • Built-in under voltage protection and over temperature, over current protection and temperature output
  • Built-in fast recovery bootstrap diode with current limiting resistor
  • Insulation class 1500 Vrms / min
  • High reliability and thermal stability,good parameter consistency
  • Built-in temperature output
Internal Electrical Schematic: 
 
 
DIP-24: Lower parasitic capacitance and inductance
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